Set up, operate, or tend grinding and related tools that remove excess material or burrs from surfaces, sharpen edges or corners, or buff, hone, or polish metal or plastic work pieces.
Perform any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.